document number: 81308 for technical questions, contact: detectortechsupport@vishay.com www.vishay.com rev. 1.5, 24-sep-09 1 ambient light sensor temd6010fx01 vishay semiconductors description temd6010fx01 ambient light sensor is a pin photodiode with high speed and high photo sens itivity in a clear, surface mount plastic package. the detector chip has 0.27 mm 2 sensitive area. it is sensitive to visible light much like the human eye and has peak sensitivity at 540 nm. features ? package type: surface mount ? package form: 1206 ? dimensions (l x w x h in mm): 4 x 2 x 1.05 ? radiant sensitive area (in mm 2 ): 0.27 ? aec-q101 qualified ? high photo sensitivity ? adapted to human eye responsivity ? supression filter for near infrared radiation ? angle of half sensitivity: ? = 60 ? floor life: 168 h, msl 3, acc. j-std-020 ? lead (pb)-free reflow soldering ? compliant to rohs directive 2002/95/ec and in accordance to weee 2002/96/ec applications ? automotive sensors ? ambient light sensors ? backlight dimming ? mobil phones ? notebooks ? computers note test conditions see table ?basic characteristics? note moq: minimum order quantity note t amb = 25 c, unless otherwise specified 1 8 527-1 product summary component i ra (a) ? (deg) 0.5 (nm) temd6010fx01 1 60 430 to 610 ordering information ordering code packaging remarks package form temd6010fx01 tape and reel moq: 3000 pcs, 3000 pcs/reel 1206 absolute maximum ratings parameter test condition symbol value unit reverse voltage v r 16 v power dissipation p v 100 mw junction temperature t j 100 c operating temperature range t amb - 40 to + 100 c storage temperature range t stg - 40 to + 100 c soldering temperature acc. refl ow solder profile fig. 7 t sd 260 c thermal resistance junction/ambient soldered on pcb with pad dimensions: 4 mm x 4 mm r thja 450 k/w
www.vishay.com for technical questions, contact: detectortechsupport@vishay.com document number: 81308 2 rev. 1.5, 24-sep-09 temd6010fx01 vishay semiconductors ambient light sensor note t amb = 25 c, unless otherwise specified basic characteristics t amb = 25 c, unless otherwise specified fig. 1 - reverse dark current vs. ambient temperature fig. 2 - reverse light current vs. illuminance fig. 3 - diode capacitance vs. reverse voltage fig. 4 - relative spectral sensitivity vs. wavelength basic characteristics parameter test condition symbol min. typ. max. unit breakdown voltage i r = 100 a, e = 0 lx v (br) 16 v reverse dark current v ce = 5 v, e = 0 lx i ro 230na diode capacitance v r = 0 v, f = 1 mhz, e = 0 lx c d 60 pf v r = 5 v, f = 1 mhz, e = 0 lx c d 24 pf reverse light current e e = 1 mw/cm 2 , = 550 nm, v r = 5 v i ra 1a e v = 100 lx, cie illuminant a, v r = 5 v i ra 0.03 0.04 a temperature coefficient of i ra e v = 100 lx, cie illuminant a, v r = 5 v tk ira 0.2 %/k angle of half sensitivity ? 60 deg wavelength of peak sensitivity p 540 nm range of spectral bandwidth 0.5 430 to 610 nm 0.01 0.1 1 10 100 1000 1 88 1 8 0204060 8 0 100 t am b - am b ient temperat u re (c) i ro - re v erse dark c u rrent (na) v r = 5 v 20093 0.001 0.01 0.1 1 10 10 100 1000 10000 e v - ill u minance (lx) i ra - photoc u rrent ( a) cie ill u minant a v r = 5 v 20094 0 10 20 30 40 50 60 70 0102030 v r - re v erse v oltage ( v ) c d - diode capacitance (pf) e 0 = 0 f = 1 mhz 0.0 0.2 0.4 0.6 0. 8 1.0 400 600 8 00 1000 w a v elength (nm) relati v e spectral sensiti v ity photodiode h u man eye 20047
document number: 81308 for technical questions, contact: detectortechsupport@vishay.com www.vishay.com rev. 1.5, 24-sep-09 3 temd6010fx01 ambient light sensor vishay semiconductors fig. 5 - relative radiant sensitivity vs. angular displacement reflow solder profile fig. 6 - lead (pb)-free reflow so lder profile acc. j-std-020d drypack devices are packed in moisture barrier bags (mbb) to prevent the products from moisture absorption during transportation and storage. each bag contains a desiccant. floor life time between soldering and removing from mbb must not exceed the time indicated in j-std-020: moisture sensit ivity: level 3 floor life: 168 h conditions: t amb < 30 c, rh < 60 % drying in case of moisture absorption devices should be baked before soldering. conditions see j-std-020 or label. devices taped on reel dry using recommended conditions: 192 h at 40 c (+ 5 c), rh < 5 % or 96 h at 60 c (+ 5 c), rh < 5 %. package dimensions in millimeters 0.4 0.2 0 s rel - relati v e sensiti v ity 94 8 31 8 0.6 0.9 0. 8 0 30 10 20 40 50 60 70 8 0 0.7 1.0 ? - ang u lar displacement 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time (s) temperat u re (c) 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 30 s max. ramp u p 3 c/s max. ramp do w n 6 c/s 19 8 41 255 c specifications according to di n technical dra w ings dra w ing- n o.: 6.541-50 8 0.01-4 iss u e: 1; 31.0 8 .09 cathode anode 4 0.15 0.75 0.6 1 2 0.15 2.4 0.15 0.45 1.05 0.15 n ot indicated tolerances 0.1 1.1 1.1 0. 8 0. 8 1 0.3 2.45 recommended solder pad footprint 7 2 0.15 1 0.15 21 88 4
www.vishay.com for technical questions, contact: detectortechsupport@vishay.com document number: 81308 4 rev. 1.5, 24-sep-09 temd6010fx01 vishay semiconductors ambient light sensor blister tape dimensions in millimeters reel dimensions in millimeters volume: 3000 pcs/reel dra w ing- n o.: 9.700-5329.02-4 specifications according to di n technical dra w ings iss u e: 2; 31.0 8 .09 2 4 ? 1.55 0.05 0.3 0.05 1.35 4 2.26 1.75 5.5 12 0.3 4.26 3 ? 1.5 min. n ot indicated tolerances 0.1 reel off direction cathode anode 20 8 77 20 8 74
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